EMI/RFI Shielding Copper Foil Tape for Electronic Devices Alternative to 3M 1181
1. Excellent electrical conductivity across the tape surface and adhesive
2. Strong adhesion to metal, plastic, and other substrates
3. Easy to wrap around wires, cables, and irregular surfaces
4. Provides high-performance EMI and RFI shielding
5. Resistant to heat, moisture, and chemical corrosion
6. Can be soldered for reliable grounding or circuit repair
7. Ideal for manual or automated application processes
| Model | AHS-8502 | AHS-8503 | AHS-8505 | AHS-8506 | AHS-8507 | AHS-8509 | AHS-8512 |
| Product Name | Copper Foil Tape | Copper Foil Tape | Copper Foil Tape | Copper Foil Tape | Copper Foil Tape | Copper Foil Tape | Tin-Plating copper foil tape |
| Backing | Copper foil/ Nano Carbon copper foil | Copper foil/ Nano Carbon copper foil | Copper foil/ Nano Carbon copper foil | Copper foil/ Nano Carbon copper foil | Copper foil/ Nano Carbon copper foil | Copper foil/ Nano Carbon copper foil | Copper foil |
| TotalThickness (mm) | 0.02 | 0.03 | 0.05 | 0.06 | 0.07 | 0.09 | 0.12 |
| Copper foil Thickness(mm) | 0.009 | 0.009 | 0.018 | 0.025 | 0.035 | 0.05 | 0.045 |
| Peel Adhesion | 1.2 | 1.2 | 1.2 | 1.2 | 1.2 | 1.2 | |
| Surface Resistance(Ω） | ≤0.05 | ≤0.05 | ≤0.05 | ≤0.05 | ≤0.05 | ≤0.05 | ≤0.03 |
| Holding power | 48 | 48 | 48 | 48 | 48 | 48 | 48 |
| 1kg/25mm/h | |||||||
| Short-term temperature（ ℃） | 120 | 120 | 120 | 120 | 120 | 120 | 250 |
| Long-term temperature（ ℃） | 80 | 80 | 80 | 80 | 80 | 80 | 220 |
| Remark | Single side conductive and double side conductive as optional | ||||||
* EMI/RFI shielding in electronic devices and enclosures
* Grounding in PCBs, cables, and electrical assemblies
* Static discharge and signal isolation
* Solderable surfaces for temporary or permanent circuit repair
* Used in smartphones, computers, audio devices, and aerospace systems
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