Thermal Release Tape for Electronic Component Processing Nitto3195 Alternative

Short Description:

Thermal release tape is a specialized adhesive tape designed to temporarily bond materials together during processing and then be easily removed when heated. It features a unique adhesive that becomes less tacky or completely non-adhesive when exposed to elevated temperatures, allowing for clean and residue-free removal. This tape is commonly used in electronics manufacturing, semiconductor processing, and other precision industries where components need to be securely held in place during assembly or fabrication but must be released without damage afterward.

Send email to us Download as PDF

Product Detail

Product Tags

Product Features

1. Adheres just like any normal adhesive tape at room temperature, can easily be peeled off when necessary by just heating.
2. Various shapes available such as in sheets, rolls and labelers.
3. Available to select temperatures for releasing.
4. Contributes to automation/laborsaving since the tape can be removed at a uniform temperature.
5. Does not damage substrates upon tape removal.

Product Technical Data

Property	Value
Carrier	Polyester film
Adhesive Type	Thermal-release adhesive
Backing	Polyester
Adhesive Side	Single Side
Tape Color	Green/Blue/Yellow/Customized
Total Tape Thickness	0.1/0.15mm(Customized)
Elongation(%)	150
180 degree Peel Adhesion	600g/25mm
Releasing temperature	90~150C℃

Product Application

* Used for precision components processing and temporary positioning
* Temporary fixing and positioning of the Semi Conductor Components
* Positioning circuit board components
* Temporary fixing and positioning of the glass screen
* Silicon wafer grinding and positioning
* Positioning for MLCC/MLCK Slitting
* High-end nameplate positioning cutting, etc
* Temporary fixing and positioning of the Lithium Battery