Thermal Release Tape for Electronic Component Processing
*Adheres just like any normal adhesive tape at room temperature; can easily be peeled off when necessary by just heating.
*Various shapes available such as in sheets, rolls and labelers.
*Available to select temperatures for releasing.
*Contributes to automation/laborsaving since the tape can be removed at a uniform temperature.
*Does not damage substrates upon tape removal.
Carrier | Polyester film |
Adhesive Type | Thermal-release adhesive |
Backing | Polyester |
Adhesive Side | Single Side |
Tape Color | Green/Blue/Yellow |
Total Tape Thickness | 0.1/0.15mm(customizable) |
Elongation(%) | 150 |
180 degree Peel Adhesion | 600g/25mm |
Releasing temperature | 90~150C |
![](/uploads/Thermal-Release-Tape-technical-data.png)
*For electronic component manufacturing processes and other various temporary fixing.
*For processing brittle wafer, especially recommended for semiconductor wafer backing grind processing.
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