Die Cutting UV Dicing Tape for Wafer Backgrinding

UV Dicing Tape is made with a PO or PET film substrate, coated with acrylic adhesive and combined with a PET release film. It has high transmittance and strong initial tack. The adhesive strength decreases after UV irradiation. This double-sided tape is designed for wafer grinding, cutting, and fine electronic component processing. It is also suitable for cutting small parts. It provides strong adhesion during grinding and cutting, ensuring precise work. After processing, moderate ultraviolet radiation instantly reduces the adhesive strength, allowing easy removal without residue or surface contamination. The IC remains intact during irradiation.