Blue PVC Film Non UV Dicing Semiconductor Wafer Processing Tape

Short Description:

Non-UV dicing tape series are made either of PVC or PO film. It is specially designed for wafer dicing process. It can be removed cleanly without UV exposition and recover easily after expansion. This product consists of a blue or clear transparent PVC film coated with a pressure sensitive acrylic-based adhesive. For easy unwind, the backing of the PVC-film is coated with a special silicone release. Suitable for processing of stainless steel plates, aluminum plates, nameplates, etc.

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Product Detail

Product Tags

Product Features

1.Acid and alkali corrosion resistance

2.suitable for metal surfaces protection.

3.No adhesive residue on the surface after tearing off.

4.Well protection for metal and board.

Product Technical Data

Material	PVC film
Feature	Heat-Resistant, no residual glue left
Width	from 1mm to 1240mm
Length	50m/100m/customized
Thickness	0.08mm/0.1mm/customized
Adhesion	120g±30g/25mm
Tensile Strength	65N/25mm
Elongation	160%
Sample	Freely Provided