Quick communication: +86 18120754215 (WhatsApp/ Wechat/ Skype/ Phone Call)
E-mail: info@aerchs.com

Die Cutting UV Dicing Tape for Wafer Backgrinding

Short Description:

UV Dicing Tape is made with a PO or PET film substrate, coated with acrylic adhesive and combined with a PET release film. It has high transmittance and strong initial tack. The adhesive strength decreases after UV irradiation. This double-sided tape is designed for wafer grinding, cutting, and fine electronic component processing. It is also suitable for cutting small parts. It provides strong adhesion during grinding and cutting, ensuring precise work. After processing, moderate ultraviolet radiation instantly reduces the adhesive strength, allowing easy removal without residue or surface contamination. The IC remains intact during irradiation.


Product Detail

Product Tags

Product Features 

1. Provides strong adhesion during cutting.
2. Rapid response to UV irradiation, improving work efficiency.
3. Maintains wafer integrity and minimizes chip loss during processing.
4. Ensures firm wafer settlement, preventing movement, falling off, and water permeation.
5. Offers moderate flexibility.
6. Offers UV tapes and customizable sizes to meet individual requirements.
7. Excellent cutting and loading performance.
8. Suitable for low-temperature applications on the backside of the wafer.

Product Technical Data

Model AHS-6309 AHS-6313 AHS-6317 AHS-6306 AHS-6313-1
Product Name UV Dicing Tape UV Dicing Tape UV Dicing Tape UV Dicing Tape UV Dicing Tape
TotalThickness (mm) 0.09 0.13 0.17 0.06 0.13
Base Film Thickness(mm) 0.08 0.1 0.15 0.05 0.1
Base Film PO PO PO PET PET
Liner PET film PET-36 PET-36 PET-25 PET-36
Adhesive Acrylic Acrylic Acrylic Acrylic Acrylic
Peel force (Before UV) 300gf/25mm 1000gf/25mm 1200gf/25mm 800gf/25mm 2000gf/25mm
Peel force (After UV) 10gf/25mm 20gf/25mm 20gf/25mm 10gf/25mm 25gf/25mm
Tensile Strength
(N/10mm)
MD:21N/10mm TD:18N/10mm MD:26kg/mm2 TD:22kg/mm2 MD:38N/10mm TD:31N/10mm MD:19kg/mm2 TD:21kg/mm2 MD:21kg/mm2 TD:23kg/mm2
Elongation(%) MD:600%  TD:600% MD:600%  TD:600% MD:600%  TD:600% MD:140%  TD:120% MD:150%  TD:130%
 Surface Resistance / / / 10^9-11 10^9-11

Product Application 

* Wafer grinding and cutting
* Ceramic components and LED radiator substrate cutting
* Glass substrate polishing and cutting
* Easy remova
* Temporary protection

uv curable dicing tape application

  • Previous:
  • Next:

  • Write your message here and send it to us