UV Release Dicing Tape for Wafer Semiconductor Polishing
*Provides strong adhesion during cutting
*Rapid response to UV irradiation, improving work efficiency.
*Maintains wafer integrity and minimizes chip loss during processing.
*Ensures firm wafer settlement, preventing movement, falling off, and water permeation.
*Offers moderate flexibility.
*Offers UV tapes and customizable sizes to meet individual requirements.
*Excellent cutting and loading performance.
*Suitable for low-temperature applications on the backside of the wafer.
Model | AHS-6309 | AHS-6313 | AHS-6317 | AHS-6306 | AHS-6313-1 |
Product Name | UV Dicing Tape | UV Dicing Tape | UV Dicing Tape | UV Dicing Tape | UV Dicing Tape |
TotalThickness (mm) | 0.09 | 0.13 | 0.17 | 0.06 | 0.13 |
Base Film Thickness(mm) | 0.08 | 0.1 | 0.15 | 0.05 | 0.1 |
Base Film | PO | PO | PO | PET | PET |
Liner | PET film | PET-36 | PET-36 | PET-25 | PET-36 |
Adhesive | Acrylic | Acrylic | Acrylic | Acrylic | Acrylic |
Peel force (Before UV) | 300gf/25mm | 1000gf/25mm | 1200gf/25mm | 800gf/25mm | 2000gf/25mm |
Peel force (After UV) | 10gf/25mm | 20gf/25mm | 20gf/25mm | 10gf/25mm | 25gf/25mm |
Tensile Strength (N/10mm) |
MD:21N/10mm TD:18N/10mm | MD:26kg/mm2 TD:22kg/mm2 | MD:38N/10mm TD:31N/10mm | MD:19kg/mm2 TD:21kg/mm2 | MD:21kg/mm2 TD:23kg/mm2 |
Elongation(%) | MD:600% TD:600% | MD:600% TD:600% | MD:600% TD:600% | MD:140% TD:120% | MD:150% TD:130% |
Surface Resistance | / | / | / | 10^9-11 | 10^9-11 |
*Wafer grinding and cutting
*Ceramic components and LED radiator substrate cutting
*Glass substrate polishing and cutting
*Easy remova
*Temporary protection
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